Pressing method of a flexible printed circuit board and a substrate
AssigneeSamsung Display Co., Ltd.
InventorJae Uk Cho
Life of this patent
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Abstract
A pressing method operatively associated with a press apparatus includes: providing a first substrate connected with a flexible printed circuit board onto a stage; providing a second substrate onto the stage; arranging the flexible printed circuit board on the second substrate; pressing a pad electrode-free area of the flexible printed circuit board; and pressing first pad electrodes of the flexible printed circuit board and second pad electrodes of the second substrate.
Claims6
A pressing method operatively associated with a press apparatus, the method comprising:
- providing a first substrate connected with a flexible printed circuit board at a first connection portion of the flexible printed circuit board onto a first stage portion of the press apparatus;
- providing a second substrate onto a second stage portion of the press apparatus;
- arranging pad electrodes of the flexible printed circuit board on pad electrodes of the second substrate;
- firstly pressing a pad electrode-free area of the flexible printed circuit board, the pad electrode-free area being between the first connection portion of the flexible printed circuit board and the pad electrodes of the flexible printed circuit board;
- and
- subsequently to the firstly pressing of the pad electrode-free area, secondly pressing the pad electrodes of the flexible printed circuit board and the pad electrodes of the second substrate while pressing of the pad electrode-free area of the firstly pressing.
A pressing method operatively associated with a press apparatus, the method comprising:
- providing a first substrate connected with a flexible printed circuit board onto a stage of the press apparatus;
- providing a second substrate onto the stage;
- arranging the flexible printed circuit board on the second substrate;
- pressing a pad electrode-free area of the flexible printed circuit board;
- and
- pressing first pad electrodes of the flexible printed circuit board and second pad electrodes of the second substrate;
- wherein the pressing of the pad electrode-free area includes:
- passing a guide pin of the press apparatus through a first coupling hole formed in the flexible printed circuit board and a second coupling hole formed in the second substrate;
- and
- pressing the pad electrode-free area by using the guide pin.
Dependencies are inferred from the claim text.