Air-stable conductive ink
AssigneeThe Research Foundation for The State University of New York
InventorsChuan-Jian Zhong, Shan Yan, Shiyao Shan, Ning He, Ning Kang, Jin Luo
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Abstract
A low temperature sinterable copper nanoparticle or nanowire, comprising gold, zinc, nickel, tin, or aluminum as an alloying metal, and a capping agent. The nanoparticles or nanowires may be deposited on porous or fibrous substrates, the capping agent desorbed, and sintered at low temperature to form conductive traces or sensing elements. The nanoparticles or nanowires may be deposited by aerosol jet, inkjet or dispenser printers, for example.
Claims20
A sinterable conductive coating composition, comprising:
- nanowires decorated with capped nanoparticles, each capped nanoparticle comprising an alloy of at least 1% copper and at least 1% gold, nickel, aluminum, zinc or tin, capped with a capping agent comprising at least one of an amine, a thiolate and an acrylate
- the decorated nanowires being configured to sinter in a buffer solution on a substrate that desorbs the capping agent at a temperature below 100° C.
A sinterable composition, comprising:
- a plurality of nanowires;
- a plurality of nanoparticles having a diameter between 2 to 20 nm, comprising an alloy of at least 1% copper and at least 1% of gold, zinc, nickel, aluminum, or tin, the nanoparticles being capped with a capping agent, wherein the plurality of nanoparticles decorate the plurality of nanowires, and
- a buffer solution in which the decorated nanowires are suspended and free to move,
- wherein the sinterable composition is adapted to initiate sintering to form a conductive layer of sintered overlapping nanowires by desorption of the capping agent from the plurality of nanoparticles by contact with a substrate in the buffer solution at a sintering temperature below 100° C.
A sinterable conductive coating composition, comprising:
- a plurality of nanowires;
- a plurality of nanoparticles adherent to the plurality of nanowires, the plurality of nanoparticles comprising at least 1% metallic copper and at least 1% of metallic gold, zinc, nickel, aluminum, or tin, capped with a capping agent;
- and
- a buffer solution;
- the plurality of nanoparticles being configured to form a sintered coating bridging the nanowires in an overlapping array to form a conductive path between respective overlapping nanowires on a substrate which desorbs the capping agent in the buffer solution to initiate sintering,
- wherein the capping agent is configured to:
- maintain the plurality of nanowires in a freely suspended state in the buffer solution before deposition on the substrate, and
- permit sintering of the plurality of nanoparticles at a temperature of less than 100° C. after deposition of the plurality of nanowires in the freely suspended state in the buffer solution on the substrate, and desorption of the capping agent from the nanoparticles to initiate sintering, to form the overlapping array.
Dependencies are inferred from the claim text.