Separation/recovery method for laminated film
AssigneeDIC Corporation
InventorsShin-ichi Ohara, Yutaka Hamasuna, Hideoki Iwanami, Hideyasu Teramoto, Takashi Tamaoka, Yoshitomo Nagata, Yasuhiro Sente
Life of this patent
Estimating the term…
Loading patent…
AssigneeDIC Corporation
InventorsShin-ichi Ohara, Yutaka Hamasuna, Hideoki Iwanami, Hideyasu Teramoto, Takashi Tamaoka, Yoshitomo Nagata, Yasuhiro Sente
Estimating the term…
A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20° C. to 90° C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.
A method for recovering resin films from a laminate, the method comprising:
Dependencies are inferred from the claim text.