System and method of dielectric bonding
AssigneeTeijin Automotive Technologies, Inc.
InventorsHugh Foran, Noriyuki Amano, Joshua Dech
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Abstract
A system and method for dielectric bonding including a dielectric heater having a pair of opposing electrode plates, a nest removably coupled to a first electrode plate of the pair of electrode plates, and an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates. The nest having a plurality of cooling channels defined in a body thereof in which a cooling fluid circulates to cool a material assembly that is supported by the nest. The interchangeable electrode assembly having a plurality of concentrator members that are configured to concentrate energy from a voltage source in predetermined locations on the material assembly.
Claims18
A system for dielectric bonding, the system comprising:
- a dielectric heater having a pair of opposing electrode plates;
- a nest removably coupled to a first electrode plate of the pair of electrode plates, the nest being configured to support a material assembly, the nest having a plurality of first cooling channels defined in a body thereof, the first cooling channels configured to circulate a first cooling fluid therein to cool the material assembly;
- an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates, the electrode assembly having a plurality of concentrator members, each of the concentrator members having a second cooling channel defined in a body thereof to circulate a second cooling fluid therein to cool the material assembly after bonding, the plurality of concentrator members configured to concentrate energy from a voltage source in predetermined locations on the material assembly.
Dependencies are inferred from the claim text.