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US 11,984,291 B2Granted
Electron source, method for manufacturing same, and device provided with electron source
AssigneeDenka Company Limited
InventorHiromitsu Chatani
Life of this patent
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Abstract
A method for manufacturing an electron source includes steps of sandwiching a welding object in which a tip of an electron emission material and a tungsten filament overlap in direct contact between a pair of welding electrodes, and welding the tip and the tungsten filament by causing a current to flow while pressing forces are applied to the welding object by the pair of welding electrodes. A thickness of the welding object is within a range of 50 to 500 μm.
Claims8
A method for manufacturing an electron source, the method comprising steps of:
- sandwiching a welding object in which a tip of an electron emission material and a tungsten filament overlap in direct contact between a pair of welding electrodes;
- and
- welding the tip and the tungsten filament by causing a current to flow while pressing forces are applied to the welding object by the pair of welding electrodes,
- wherein a thickness of the welding object is within a range of 50 to 500 μm.
1 more element
An electron source comprising:
- a tip of an electron emission material;
- a tungsten filament;
- and
- a welding portion in which the tip and the tungsten filament are directly bonded,
- wherein a thickness of the welding portion is 50 to 500 μm, and
- wherein the electron emission material is selected from the group consisting of LaB6, HfC, and an IrCe compound.
3 more elements
An electron source comprising:
- a tip of an electron emission material;
- a tungsten filament;
- and
- a welding portion in which the tip and the tungsten filament are directly bonded,
- wherein a thickness of the welding portion is 50 to 500 μm,
- wherein the tungsten filament contains rhenium.
3 more elements
Dependencies are inferred from the claim text.