Method for testing a chip card element
AssigneeGiesecke+Devrient Mobile Security GmbH
InventorMichael Baldischweiler
Life of this patent
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Abstract
A method is provided for testing a card body with a metallic core layer for a contactless or dual-interface chip card, and a method is provided for manufacturing a contactless or dual-interface chip card. The method involves testing the functionality of the card body before the chip module employed for testing, or a corresponding chip module, is fixed into the cavity of the card body. A card body having impurities, a partial closure or full closure in the slot of its metallic core layer fails the test and is not used at all for fixing the chip module and for the subsequent manufacturing steps.
Claims15
A method for testing a card body with a metallic core layer for a contactless or a dual-interface chip card, comprising the steps of:
- making available the metallic core layer with a cavity for fixing a chip module in a fixing position in the cavity and with at least one slot which extends from the cavity to an edge of the metallic core layer;
- making available the or a chip module with an oscillating circuit which comprises a chip and an antenna coil coupled to the chip;
- positioning the chip module made available in the cavity in or above the fixing position;
- and
- testing the oscillating circuit of the positioned chip module before a fixing of the chip module in the cavity.
Dependencies are inferred from the claim text.