Optical micro-electromechanical system with flip chip packaging

Abstract

Several optical micro-electromechanical systems (OptoMEMS) are provided. One of the OptoMEMS comprises an OptoMEMS chip, and a photonic chip coupled to the OptoMEMS chip; wherein the OptoMEMS chip comprises a photonic cavity and a first platform on which the photonic cavity is fabricated, and the photonic chip comprises a waveguide and a second platform on which the waveguide is fabricated; wherein the photonic cavity comprises at least one dielectric beam, each of which further comprises at least one array of air holes; wherein the photonic cavity is at least partially made of a photonic crystal, and the lattice constant of the photonic crystal is reduced or increased gradually in a central region of the photonic cavity, allowing the light of a specific frequency to be trapped in the center region.

Dependencies are inferred from the claim text.