Mold release agent for metal casting, containing pinene epoxide and/or decene-1 oxide
AssigneeASK Chemicals GmbH
InventorsSritama Kar, Christian Priebe
Life of this patent
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Abstract
A release agent is disclosed for use with an organic binder system used in metal casting. The binder system has a Part I component including an epoxy resin and a free radical initiator and a Part II component having an epoxy resin and an acrylate, where the Part I and Part II components are kept separate until the time of use. The release agent will typically have a molecular weight in the range of 150 to 160, with eight to ten carbon atoms. Two examples of the epoxide are pinene oxide and decene-1 oxide, each of which is effective as an internal release agent when present in the binder for a cold box process in the range of about 0.15% to about 1% of the total weight of the Part I and Part II components.
Claims10
A foundry mix, comprising:
- a foundry aggregate;
- and
- a binder system comprising:
- a Part I component comprising:
- a bisphenol A-epichlorohydrin polymer as an epoxy resin, present at a concentration of greater than or equal to 50% by weight and less than 70% by weight of the component;
- and cumene hydroperoxide as a free radical initiator, present at a concentration of greater than or equal to 20% by weight and less than 30% by weight of the component;
- a Part II component comprising:
- a bisphenol A-epichlorohydrin polymer as an epoxy resin, present at a concentration of greater than or equal to 30% by weight and less than 50% by weight of the component;
- trimethylol propane triacrylate (TMPTA), present at a concentration of greater than or equal to 30% by weight and less than 50% by weight of the component;
- and
- an epoxide comprising at least one of pinene oxide and decene-1 oxide;
- wherein the Part I and Part II components, respectively, are included in the binder system at weight ratio of 50/50;
- wherein the epoxide is present as part of the Part II component in an amount ranging from about 0.3% to about 2.0% by weight of the Part II component;
- and
- wherein at least the Part I component and the Part II component are mixed together and combined with the foundry aggregate.
A foundry mix, comprising:
- a foundry aggregate;
- and
- a binder system comprising:
- a Part I component comprising:
- a phenol-formaldehyde polymer glycidyl ether as an epoxy resin, present at a concentration of greater than or equal to 50% by weight and less than 70% by weight of the component;
- and cumene hydroperoxide as a free radical initiator, present at a concentration of greater than or equal to 30% by weight and less than 50% by weight of the component;
- a Part II component comprising:
- a bisphenol A-epichlorohydrin polymer as an epoxy resin, present at a concentration of greater than or equal to 20% by weight and less than 30% by weight of the component;
- trimethylol propane triacrylate (TMPTA), present at a concentration of greater than or equal to 50% by weight and less than 70% by weight of the component;
- and hexanediol diacrylate, present at a concentration of greater than or equal to 5% by weight and less than 10% by weight of the component;
- and
- an epoxide comprising at least one of pinene oxide and decene-1 oxide;
- wherein the Part I and Part II components, respectively, are included in the binder system at weight ratio of 60/40;
- wherein the epoxide is present as part of the Part II component in an amount ranging from about 0.3% to about 2.0% by weight of the Part II component;
- and
- wherein at least the Part I component and the Part II component are mixed together and combined with the foundry aggregate.
Dependencies are inferred from the claim text.