Polishing device, polishing method, and recording medium for recording program for determining supply position of polishing liquid

A polishing method comprising:

• obtaining a correlation between a supply position of a polishing liquid in a radial direction of a polishing pad using a liquid injection nozzle which injects the polishing liquid onto the polishing pad in a fan shape and an average polishing rate of a substrate and an distribution of a polishing rate within the substrate;
• determining a movable range of the liquid injection nozzle from a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate, wherein the movable range of the liquid injection nozzle is determined according to supply positions of the liquid injection nozzle whose average polishing rates are within the predetermined range of the allowable average polishing rate;
• determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle;
• and
• cause a nozzle moving device to move the liquid injection nozzle to the determined supply position to polish the substrate.

A non-transitory computer-readable recording medium storing instructions, which when executed by a computer, cause the computer to:

• obtain a correlation between a supply position of a polishing liquid in a radial direction of a polishing pad using a liquid injection nozzle which injects the polishing liquid onto the polishing pad in a fan shape and an average polishing rate of a substrate and an distribution of a polishing rate within the substrate;
• determine a movable range of the liquid injection nozzle from a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate, wherein the movable range of the liquid injection nozzle is determined according to supply positions of the liquid injection nozzle whose average polishing rates are within the predetermined range of the allowable average polishing rate;
• determine an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle;
• and
• cause a nozzle moving device to move the liquid injection nozzle to the determined supply position to polish the substrate.