Dressing apparatus and polishing apparatus
AssigneeOkamoto Machine Tool Works, Ltd.
InventorsTakahiko Mitsui, Eiichi Yamamoto
Life of this patent
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Abstract
A dressing apparatus includes a dresser provided in a polishing apparatus for polishing a board-like work by relative movement between the work and a polishing pad while bringing the polishing pad into contact with the work, the dresser having a dressing surface that slides relative to a polishing surface of the polishing pad to dress the polishing pad; a dresser drive member that rotates the dresser; a high-pressure water generating device that supplies high-pressure water pressurized to 1 to 15 MPa; and a high-pressure water injection nozzle that injects the high-pressure water toward the dressing surface rotating.
Claims9
A dressing apparatus comprising:
- a dresser provided in a polishing apparatus for polishing a work by relative movement between the work and a polishing pad while bringing the polishing pad into contact with the work, the dresser having a dressing surface that slides relative to a polishing surface of the polishing pad to dress the polishing pad;
- a dresser drive member that rotates the dresser;
- a first high-pressure water generating device that supplies first high-pressure water pressurized to 1 to 15 MPa;
- a second high-pressure water generating device that supplies second high-pressure water pressurized to 1 to 15 MPa;
- a first high-pressure water injection nozzle that injects the first high-pressure water toward the dressing surface rotating;
- and
- a second high-pressure water injection nozzle that injects the second high-pressure water toward the polishing surface of the polishing pad rotating, wherein
- the dressing surface of the dresser faces upward;
- the polishing surface of the polishing pad faces downward;
- the first high-pressure water injection nozzle faces downward and injects the first-high pressure water downwardly toward the dressing surface;
- and
- a vertical axis of the rotating dresser and a vertical axis of the polishing pad are horizontally offset such that the second high-pressure water injection nozzle faces upward and injects the second-high-pressure water upwardly toward the polishing surface while the first high-pressure water injection nozzle injects the first-high pressure water downwardly toward the dressing surface.
A polishing apparatus comprising:
- a polishing surface plate that holds a work so that a surface to be polished of a work faces upward and rotates the work;
- a polishing head that holds a polishing pad so that a polishing surface of the polishing pad faces the surface to be polished and rotationally presses the polishing pad;
- a water tank provided at a position away from the polishing surface plate;
- a diamond dresser provided above the water tank and having a dressing surface on which diamond abrasive grains are electrodeposited;
- a dresser drive member that rotates the diamond dresser;
- a polishing head feed member that relatively moves the polishing head from a polishing position above the polishing surface plate to a dressing position above the water tank, in which the polishing surface slides relative to the dressing surface and is dressed;
- a first high-pressure water generating device that supplies first high-pressure water pressurized to 1 to 15 MPa;
- a second high-pressure water generating device that supplies second high-pressure water pressurized to 1 to 15 MPa;
- a first high-pressure water injection nozzle that injects the first high-pressure water toward the dressing surface rotating above the water tank;
- and
- a vertical axis of the rotating dresser and a vertical axis of the polishing pad are horizontally offset such that a second high-pressure water injection nozzle that is sent to above the water tank and injects the second high-pressure water toward the polishing surface rotating while the first high-pressure water injection nozzle injects the first-high pressure water toward the dressing surface rotating above the water tank.
Dependencies are inferred from the claim text.