Display device, method for manufacturing display device, heat dissipation layer, and electronic device

A heat dissipation layer, comprising:

• a first heat dissipation layer;
• a second heat dissipation layer on the first heat dissipation layer, wherein an area of an orthographic projection of the second heat dissipation layer on a plane parallel to the first heat dissipation layer is smaller than an area of an orthographic projection of the first heat dissipation layer on the plane, and the orthographic projection of the second heat dissipation layer on the plane is within the orthographic projection of the first heat dissipation layer on the plane;
• and
• a third heat dissipation layer on a side of the second heat dissipation layer away from the first heat dissipation layer, and covering all surfaces, that are not in contact with the first heat dissipation layer, of the second heat dissipation layer,
• wherein a thermal conductivity of the second heat dissipation layer is greater than a thermal conductivity of the first heat dissipation layer, or the thermal conductivity of the second heat dissipation layer is greater than a thermal conductivity of the third heat dissipation layer.

A method for manufacturing a display device, comprising:

• providing a silicon-based organic light-emitting display panel;
• connecting a flexible printed circuit board to the silicon-based organic light-emitting display panel;
• and
• forming a heat dissipation layer on a non-display side of the silicon-based organic light-emitting display panel, and extending the heat dissipation layer to the flexible printed circuit board to cover at least a part of the flexible printed circuit board,
• wherein the forming the heat dissipation layer on the non-display side of the silicon-based organic light-emitting display panel, and the extending the heat dissipation layer to the flexible printed circuit board to cover at least the pan of the flexible printed circuit board comprises:
• forming a first heat dissipation layer on the non-display side of the silicon-based organic light-emitting display panel by using an evaporation process or an electroforming method;
• forming a second heat dissipation layer on the first heat dissipation layer, wherein an orthographic projection of the second heat dissipation layer on a plane parallel to the first heat dissipation layer is smaller than an orthographic projection of the first heat dissipation layer on the plane;
• and
• forming a third heat dissipation layer on the second heat dissipation layer by using the evaporation process or the electroforming method, and allowing the third heat dissipation layer to cover all surfaces, that are not in contact with the first heat dissipation layer, of the second heat dissipation layer,
• wherein a thermal conductivity of the second heat dissipation layer is greater than a thermal conductivity of the first heat dissipation layer, or the thermal conductivity of the second heat dissipation layer is greater than a thermal conductivity of the third heat dissipation layer.