Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board
AssigneeShengyi Technology Co., Ltd.
InventorZhenwen Chen
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Abstract
The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.
Claims17
A thermosetting resin composition, comprising the following components:
- a combination of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester;
- wherein a monomer of the bismaleimide resin has a structure shown in Formula I:
- wherein R1 is a substituted or unsubstituted C3-C4 alkyl group;
- R2 is an alkyl group C3 or more;
- the active ester comprises an active ester having a structure as shown in Formula III:
- wherein La is a phenyl group or a naphthyl group;
- Y in (Y)q is selected from a methyl group and an ester group;
- q is 1, 2 or 3;
- j is an integer of 1-10;
- m is an integer of 1-10.
Dependencies are inferred from the claim text.