Induction-based systems and methods for joining substrates
AssigneeOqab Dietrich Induction Inc.
InventorsHaroon B. Oqab, George B. Dietrich
Life of this patent
Estimating the term…
Abstract
An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.
Claims16
A method of joining a first substrate with a second substrate, the method comprising:
- applying a filler material including electrically conducting material or magnetic material between respective portions of the first substrate and the second substrate defining a joint, the electrically conducting material or magnetic material including at least a first material of a reactive metal compound having a first reaction temperature and a second material of the reactive metal compound having a second reaction temperature, wherein the second reaction temperature is higher than the first reaction temperature, wherein the second material is interspersed with the first material;
- applying an alternating magnetic field to the joint to heat the first material and the second material of the reactive metal compound to the first reaction temperature;
- heating the second material to the second reaction temperature with an energy released by the first material and the second material of the reactive metal compound when the first material and the second material are undergoing an exothermic reaction upon reaching the first reaction temperature;
- energizing the joint using an energy released from the second material upon reaching the second reaction;
- and
- cooling the joint to join the first substrate with the second substrate.
An induction-based apparatus to join substrates, the apparatus comprising:
- a housing;
- an inlet to receive a filler material including an electrically conducting material or magnetic material comprising a first material of a reactive metal compound having a first reaction temperature and a second material of the reactive metal compound having a second reaction temperature, wherein the second reaction temperature is higher than the first reaction temperature;
- an induction heating assembly including a coil that is housed in the housing configured to:
- receive the filler material from the inlet;
- and
- apply an alternating magnetic field to inductively energize the first material and the second material to reach the first reaction temperature;
- and
- a nozzle to expel the energized filler material for joining the first substrate and second substrate, wherein upon deposit of the energized filler material onto the first substrate and second substrate, the second material is heated to the second reaction temperature with an energy released by the first material and the second material when the first material and the second material are undergoing an exothermic reaction upon reaching the first reaction temperature, and the first substrate and the second substrate are joined together with an energy released from the second material when the second material is reaching the second reaction temperature.
Dependencies are inferred from the claim text.