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US 11,974,405 B2Granted
Electronic device housing and electronic device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungmin Moon, Jaehyun Bae, Hyunsuk Choi
Life of this patent
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Abstract
An electronic device housing, and an electronic device including the same are provided. The electronic device housing includes a substrate including glass, an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed, and an elastic layer which is between the substrate and the insert portion and extends along the surface of the insert portion.
Claims14
An electronic device housing comprising:
- a substrate comprising glass;
- an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed;
- the insert portion comprising a surface facing the substrate and at which the insert portion is bonded to the substrate;
- and
- an elastic layer which is between the substrate and the surface of the insert portion and extends along the surface of the insert portion, wherein a difference between a coefficient of expansion of the substrate and a coefficient of expansion of the insert portion is greater than or equal to about 10×10−6 m/(m° C.).
2 more elements
Dependencies are inferred from the claim text.