Electronic component and method for manufacturing the same

An electronic component manufacturing method comprising:

• a disposition step of disposing an electronic element on a supporting body so as to bring a first surface of the electronic element into close contact with the supporting body;
• a forming step of supplying an insulating material around the electronic element on the supporting body and hardening the insulating material to form a surrounding member;
• a removal step of removing the supporting body from the first surface and from a second surface of the surrounding member from which the first surface is exposed;
• and
• a joining step of disposing an insulating material that makes up a joining member between a third surface constituted by the first surface and the second surface and a wiring board to join the third surface and the wiring board together, and disposing a conductive bump between the third surface and the wiring board to electrically connect the electronic element and the wiring board to each other, wherein
• in the joining step,
• in the material that makes up the joining member,
• a first through hole that passes through the material making up the joining member from the third surface to the wiring board and overlaps the vibration region in perspective plan view, and
• a second through hole that passes through the material making up the joining member from the third surface to the wiring board and accommodates the bump are made, and
• at least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.