Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP)
AssigneeRF360 Singapore Pte. Ltd.
InventorsRobert Felix Bywalez, Ute Steinhaeusser
Life of this patent
Estimating the term…
Abstract
An apparatus and method for making an acoustic filter package where the apparatus includes a base layer; a support layer disposed on the base layer; a piezoelectric structure disposed on the support layer; wherein the piezoelectric structure comprises: a piezoelectric layer; a top electrode on a top surface of the piezoelectric layer; a bottom electrode on a bottom surface of the piezoelectric layer; a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode; and a corrosion resistant pad disposed on the contact pad; and a capping structure disposed on the piezoelectric structure.
Claims56
An apparatus including an acoustic filter package comprising:
- a base layer;
- a support layer disposed on the base layer;
- a piezoelectric structure disposed on the support layer,
- wherein the piezoelectric structure comprises:
- a piezoelectric layer;
- a top electrode on a top surface of the piezoelectric layer;
- a bottom electrode on a bottom surface of the piezoelectric layer;
- a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode;
- a corrosion resistant pad disposed on the contact pad;
- a capping structure disposed on the piezoelectric structure;
- a first dielectric layer over the piezoelectric layer, the top electrode, and at least a portion of the contact pad;
- and
- a second dielectric layer over the first dielectric layer and at least a portion of the corrosion resistant pad, and
- wherein the portion of the corrosion resistant pad is over a portion of the first dielectric layer that is over the portion of the contact pad.
A method for manufacturing an apparatus including an acoustic filter package comprising:
- forming a base layer;
- forming a support layer disposed on the base layer;
- forming a piezoelectric structure disposed on the support layer,
- wherein the forming the piezoelectric structure comprises:
- forming a piezoelectric layer;
- forming a top electrode on a top surface of the piezoelectric layer;
- forming a bottom electrode on a bottom surface of the piezoelectric layer;
- forming a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode;
- forming a first dielectric layer over the piezoelectric structure, the top electrode, and at least a portion of the contact pad;
- forming a corrosion resistant pad disposed on the contact pad;
- forming a second dielectric layer over the first dielectric layer and at least a portion of the corrosion resistant pad;
- and
- forming a capping structure disposed on the piezoelectric structure,
- wherein the portion of the corrosion resistant pad is over a portion of the first dielectric layer that is over the portion of the contact pad.
Dependencies are inferred from the claim text.