Semiconductor devices for lasing applications and methods of manufacturing such devices

A manufacturing method comprising:

• providing a structure disposed on a substrate, the structure having first and second layers, wherein the first layer is a sacrificial layer, and wherein the second layer is a compressively strained layer disposed on the first layer, the second layer comprising an alloy including germanium and tin, the structure comprising:
• first and second members spaced a distance from each other along a direction,
• a strip located between the first and second members and extending along an axis intersecting said direction,
• third and fourth members spaced a distance from each other along said direction, the strip being located between the third and fourth members, and
• arms connecting the first and second members to a first end of the strip and additional arms connecting the third and fourth members to a second end of the strip, wherein the first and second members, the strip, the third and fourth members, the arms, and the additional arms comprise respective portions of the first and second layers;
• and
• removing at least a portion of the first layer at the strip, arms, and additional arms such that the strip, arms, and additional arms become suspended, the arms remain anchored to the first layer via the first and second members, and the additional arms remain anchored to the first layer via the third and fourth members.

A device comprising a substrate and a structure disposed on the substrate, wherein the structure comprises:

• first and second members spaced a distance from each other along a direction;
• a strip located between the first and second members and extending along an axis intersecting said direction;
• and
• arms connecting the first and second members to a first end of the strip,
• wherein the first and second members comprise respective portions of a first layer, wherein the first layer is a sacrificial layer, wherein the first and second members, the strip and the arms comprise respective portions of a second layer, wherein the second layer includes a plurality of sublayers arranged as a stack of sublayers of a first type and sublayers of a second type disposed sequentially on top of each other, wherein the first type of sublayers are germanium sublayers and the second type of sublayers comprise an alloy including germanium and tin, wherein the portions of the second layer located in the first and second members are disposed on the respective portions of the first layer located in the first and second members, wherein the portions of the second layer located in the first and second members are compressively strained, wherein the strip and arms are suspended above the substrate, and wherein the arms are anchored to the first layer via the first and second members.

A device comprising a substrate and a structure disposed on the substrate, wherein the structure comprises:

• first and second members spaced a distance from each other along a direction;
• a strip located between the first and second members and extending along an axis intersecting said direction;
• arms connecting the first and second members to a first end of the strip, wherein the first and second members comprise respective portions of a first layer, wherein the first layer is a sacrificial layer, wherein the first and second members, the strip and the arms comprise respective portions of a second layer, wherein the second layer comprises an alloy including germanium and tin, wherein the portions of the second layer located in the first and second members are disposed on the respective portions of the first layer located in the first and second members, wherein the portions of the second layer located in the first and second members are compressively strained, wherein the strip and arms are suspended above the substrate, and wherein the arms are anchored to the first layer via the first and second members;
• third and fourth members spaced a distance from each other along said direction, wherein the strip is located between the third and fourth members, the third and fourth members comprising respective portions of the first and second layers, wherein the portions of the second layer located in the third and fourth members are disposed on the respective portions of the first layer located in the third and fourth members, and wherein the portions of the second layer located in the third and fourth members are compressively strained;
• and
• additional arms connecting the third and fourth members to a second end of the strip, wherein the additional arms comprise respective portions of the second layer, and wherein the additional arms are suspended above the substrate and are anchored to the first layer via the third and fourth members.