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US 11,966,074 B2Granted
Metal back plate and manufacturing process thereof, backlight module and electronic device
AssigneeBeijing Xiaomi Mobile Software Co., Ltd.
InventorZheng Wang
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a metal back plate and a manufacturing process thereof, a backlight module and an electronic device. The metal back plate is used for the backlight module. The metal back plate includes a first area and a second area. The grain size of the metal material in the first area is larger than the grain size of the metal material in the second area. The first area is formed with a first opening.
Claims18
A metal back plate for a backlight module, comprising:
- a first area and a second area, wherein grain size of a first metal material in the first area is larger than a grain size of a second metal material in the second area, and the first area is formed with a first opening that penetrates in a thickness direction of the metal back plate, and the second area has no openings;
- wherein both the first metal material in the first area and the second metal material in the second area comprise an aluminum-magnesium alloy.
Dependencies are inferred from the claim text.