Polyimide varnish composition for flexible substrate and polyimide film using same
AssigneeNexFlex Co., Ltd.
InventorsSo Jeong Kim, Joo Young Kim, Hyuk Jun Kim
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Abstract
The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible substrate according to the present disclosure may include an acid anhydride including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA), and a diamine. The polyimide varnish composition according to the present disclosure has the advantage of being able to manufacture a polyimide film having heat resistance, high flexural properties, and high flexibility by increasing elongation while having a low coefficient of thermal expansion.
Claims2
A polyimide varnish composition for a flexible substrate, the polyimide varnish composition comprising:
- an acid anhydride including 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA);
- a diamine including p-phenylenediamine (PDA) and 2-(4-aminophenyl)benzoxazole-5-amine (APBOA);
- and an imidazole-based curing catalyst,
- wherein the BPDA and the PMDA have a molar ratio of 1:9 to 3:7,
- wherein the PDA and the APBOA have a molar ratio of 7:3 to 9:1,
- wherein the imidazole-based curing catalyst is contained in an amount of 5 mol % to 50 mol % based on the total mole number of the acid anhydride and diamine, and
- wherein the imidazole-based curing catalyst has a boiling point of 250° C. or more and a pKa of 6.0 or more.
Dependencies are inferred from the claim text.