Fluorine-containing epoxy resin for electrical materials and method for manufacturing same
AssigneeDaikin Industries, Ltd.
InventorsYoshito Tanaka, Tomohiro Yoshida
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Abstract
A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being: the formula (E1) being: the formula (E2) being: the formula (E3) being: Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.
Claims6
A high frequency printed circuit board comprising a substrate coated with a film of a curable composition comprising:
- a fluorine-containing epoxy resin represented by the following formula (E):
- wherein n is an integer of 0 or greater;
- an average value of n is 0.10 or smaller;
- and M is a group represented by the following formula (E2):
- and
- a curing agent, wherein the curing agent is at least one selected from the group consisting of polyamines, polycarboxylic acids, acid anhydrides, phenols, imidazoles, polymercaptans, and organic acid hydrazides,
- wherein the amount of the curing agent is 0.1 to 50 parts by mass relative to 100 parts by mass of the fluorine-containing epoxy resin.
Dependencies are inferred from the claim text.