Method of forming an etched part and a method of forming a metal plated part
AssigneeFord Global Technologies, LLC
InventorsXiaojiang Wang, Shannon Christine Bollin, Robert D. Bedard, Matthew Cassoli, Ellen Cheng-Chi Lee
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Abstract
A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.
Claims20
A method of forming an etched part, the method comprising:
- forming a substrate comprising a thermoset resin, the thermoset resin comprising a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin;
- and
- etching a surface of the substrate,
- wherein the etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites is formed on an etched surface of the substrate.
A method of forming a metal plated part comprising:
- forming a substrate via vat photopolymerization (VPP), wherein the substrate comprises a thermoset resin with an etchable phase disposed therein;
- etching a surface of the substrate to remove at least a portion of the etchable phase proximate the surface of the substrate and to form a plurality of micro-mechanical locking sites at the surface of the substrate;
- and
- forming a metal layer on the etched surface of the substrate, such that the metal layer is bonded to the etched surface of the substrate at the plurality of micro-mechanical locking sites.
Dependencies are inferred from the claim text.