US 11,964,918 B2 · Embedding sensors in 3D-printed silicon carbide

Abstract

An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000° C.

Claims13

Dependent claims

A method for manufacturing an embedded sensor, the method comprising:

providing a powder feedstock of silicon carbide;
selectively depositing a binding agent onto successive layers of the powder feedstock according to a binder-jet printing process to produce a three-dimensional green body having a silicon carbide matrix, the green body defining a channel therein;
inserting a sensor component within the channel, the channel being open to an exterior of the green body;
and
after inserting the sensor component within the channel, heat treating the green body to remove the binding agent and densifying the silicon carbide matrix according to a chemical vapor infiltration process, wherein the densified silicon carbide matrix includes a substantially pure silicon carbide microstructure.

2 more elements

Dependencies are inferred from the claim text.

Embedding sensors in 3D-printed silicon carbide

Life of this patent

Embedding sensors in 3D-printed silicon carbide

Life of this patent

Abstract

Claims13