Dual wire welding or additive manufacturing system and method

A welding or additive manufacturing system, comprising:

• a power supply comprising a controller which controls operations of the power supply, wherein the power supply provides a current waveform to a contact tip having a first channel terminating in a first exit orifice and second channel terminating in a second exit orifice, wherein the first channel is parallel with the second channel, and the first channel is configured to pass through a first wire electrode and the second channel is configured to pass through a second wire electrode, wherein the current waveform includes a bridge current portion and another current portion having a current level different from the bridge current portion;
• wherein the first exit orifice is separated from the second exit orifice such that a distance provided between the first wire electrode and the second wire electrode facilitates a formation of a bridge droplet between the first wire electrode and the second wire electrode while preventing solid portions of the first wire electrode delivered through the first exit orifice from contacting solid portions of the second wire electrode delivered through the second exit orifice during a deposition operation, wherein the bridge droplet forms during the bridge current portion of the current waveform and couples the first wire electrode and second wire electrode prior to contacting a puddle during the deposition operation,
• wherein a current due to the current waveform flows from the contact tip to the bridge droplet through both of the first wire electrode and the second wire electrode and the current is divided between the first wire electrode and the second wire electrode, and wherein the current flows from the bridge droplet to the puddle, and
• wherein the first wire electrode and the second wire electrode are cored electrodes.

A welding or additive manufacturing system, comprising:

• a power supply comprising a controller which controls operations of the power supply, wherein the power supply provides a current waveform to a contact tip having a first channel terminating in a first exit orifice and second channel terminating in a second exit orifice, wherein the first channel is configured to pass through a first wire electrode and the second channel is configured to pass through a second wire electrode, wherein the current waveform includes a bridge current portion and another current portion having a current level less than than the bridge current portion;
• wherein the first exit orifice is separated from the second exit orifice such that a distance provided between the first wire electrode and the second wire electrode facilitates a formation of a bridge droplet between the first wire electrode and the second wire electrode while preventing solid portions of the first wire electrode delivered through the first exit orifice from contacting solid portions of the second wire electrode delivered through the second exit orifice during a deposition operation, wherein the bridge droplet forms during the bridge current portion of the current waveform and couples the first wire electrode and second wire electrode prior to contacting a puddle during the deposition operation, and
• wherein a current due to the current waveform flows from the contact tip to the bridge droplet through both of the first wire electrode and the second wire electrode and the current is divided between the first wire electrode and the second wire electrode, and wherein the current flows from the bridge droplet to the puddle.