Local stretch package structure and manufacturing method thereof

A method of manufacturing a local stretch packaging structure, comprising steps of:

• providing a substrate;
• disposing a flexible electronic element on the substrate;
• disposing a plurality of light-emitting display elements on the flexible electronic element;
• and
• disposing a packaging layer on the plurality of light-emitting display elements and a portion of the flexible electronic element,
• wherein the packaging layer comprises a packaging area and a non-packaging area, the packaging area continuously covers an upper surface and sidewalls of each one of the plurality of light-emitting display elements, and the non-packaging area directly covers the flexible electronic element that is not disposed with these light-emitting display elements, some portions of the non-packaging area are respectively located between every adjacent two of the light-emitting display element;
• wherein at a processing temperature of the substrate, and the processing temperature is from 80° C. to 180° C.:
• when a storage modulus of the substrate is higher than a storage modulus of the packaging layer, an elasticity of the non-packaging area is higher than 30%, and the elasticity of the non-packaging area increases with the increase of the storage modulus difference between the substrate and the packaging layer;
• when the storage modulus of the substrate is lower than the storage modulus of the packaging layer, the elasticity of the non-packaging area is lower than 30%, and the elasticity of the non-packaging area decreases with the increase of the storage modulus difference between the substrate and the packaging layer;
• wherein the storage modulus of the substrate at the processing temperature is from 1 MPa to 20000 MPa.