Back to results
US 11,963,350 B2Granted
Semiconductor memory device and method for fabricating the same
AssigneeSK hynix Inc.
InventorSang Hyon Kwak
Life of this patent
Estimating the term…
Abstract
A semiconductor memory device and a method for fabricating the same are provided. The semiconductor memory device includes a plurality of gate stacks separated by a plurality of slit structures, and each of the gate stacks includes: a first stack including three or more first conductive patterns spaced apart from one another at substantially a same level; a second stack formed on the first stack and including second conductive patterns and interlayer dielectric layers alternately stacked; and a plurality of channel structures penetrating the second stack and the first stack.
Claims11
A semiconductor memory device comprising:
- a plurality of gate stacks separated by a plurality of slit structures,
- wherein each of the gate stacks comprises:
- a first stack including three or more first conductive patterns spaced apart from one another in a horizontal direction;
- a second stack formed over the first stack in a vertical direction and including second conductive patterns and interlayer dielectric layers alternately stacked;
- a third stack formed over the second stack in the vertical direction and including a plurality of third conductive patterns spaced apart from one another;
- and
- a plurality of channel structures formed in the first stack to the third stack,
- wherein the first stack comprises:
- a first lower insulating layer formed under the first conductive patterns;
- a gap-fill insulating layer formed along a sidewall of each of the first conductive patterns to gap-fill between the first conductive patterns;
- and
- a first upper insulating layer formed over the gap-fill insulating layer and the first conductive patterns.
9 more elements
Dependencies are inferred from the claim text.