Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Woong Choi, Yun Je Ji, Seung Eun Lee, Yong Hoon Kim
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Abstract
A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers, a passive component disposed in the cavity and including an external electrode electrically connected to at least one of the plurality of wiring layers, and a bridge disposed on the passive component in the cavity and including one or more circuit layers electrically connected to the external electrode.
Claims17
A printed circuit board comprising:
- a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers and having a cavity penetrating through a portion of the plurality of insulating layers;
- a passive component disposed in the cavity;
- and
- a bridge disposed on the passive component in the cavity,
- wherein the bridge includes one or more circuit layers, and
- wherein the one or more circuit layers have a density higher than that of the plurality of wiring layers.
A printed circuit board comprising:
- a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers connected to one or more of the plurality of wiring layers;
- and
- a first passive component and a bridge connected to each other by a solder and embedded in the wiring substrate,
- wherein the bridge includes one or more circuit layers, and
- wherein the one or more circuit layers have a density higher than that of the plurality of wiring layers.
Dependencies are inferred from the claim text.