Component carrier having component covered with ultra-thin transition layer

A component carrier, comprising:

• a laminated stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
• and
• a component at least partially covered with a transition layer having a thickness in a range from 1.0 nm to 100 nm;
• and
• a redistribution layer being at least partially covered by the transition layer;
• wherein the component is assembled with the stack,
• wherein the component carrier is a printed circuit board, and
• wherein surfaces of the component except for at least one portion of at least one component pad being directly electrically connected to the at least one electrically conductive layer structure are in direct contact with the transition layer.

A method of manufacturing a component carrier, comprising:

• providing a laminated stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
• at least partially covering a component with a transition layer having a thickness in a range from 1.0 nm to 100 nm;
• assembling the component with the stack;
• and
• at least partially covering a redistribution layer by the transition layer;
• and
• covering the component with the transition layer before the assembling;
• wherein the component carrier is a printed circuit board or IC substrate,
• wherein surfaces of the component, except for at least one portion of at least one component pad being directly electrically connected to the at least one electrically conductive layer structure, are covered by the transition layer.