US 11,963,309 B2 · Process for laminating conductive-lubricant coated metals for printed circuit boards

Abstract

Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

Claims22

Dependent claims

A method of creating a conductive-lubricant-coated PCB comprising:

providing a lamination stack, wherein the process to create the lamination stack comprises:
providing a core;
applying an adhesive layer to a top surface of the core;
attaching a conductive-lubricant-metal structure to the top surface of the core via the adhesive layer, wherein the conductive-lubricant-metal structure comprises a metal layer having at least one of a top surface of conductive-lubricant or a bottom surface of conductive-lubricant;
plasma doping a conductive-lubricant layer of the conductive-lubricant-metal structure by growing the conductive-lubricant layer on the metal layer of the conductive-lubricant-metal structure and immersing the conductive-lubricant-metal structure in ions from plasma, wherein the plasma comprises ammonia (NH3);
and
applying a heat and a pressure to the lamination stack to form the conductive-lubricant-coated PCB.

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A method for removing a metal layer from a lamination stack comprising:

generating a lamination stack by:
providing a core;
applying an adhesive layer to a top surface of the core;
attaching a first conductive-lubricant-metal structure to the top surface of the core via the adhesive layer, wherein the first conductive-lubricant-metal structure comprises a first metal layer having at least a top surface of conductive-lubricant or a bottom surface of conductive-lubricant, wherein a first conductive-lubricant layer of the first conductive-lubricant-metal structure is plasma doped by growing the first conductive-lubricant layer on the first metal layer of the first conductive-lubricant-metal structure and immersing the first conductive-lubricant-metal structure in ions from plasma, wherein the plasma comprises ammonia (NH3);
attaching a second conductive-lubricant-metal structure to a top surface of the first conductive-lubricant-metal structure, wherein the second conductive-lubricant-metal structure comprises a second metal layer having at least a top surface of conductive-lubricant or a bottom surface of conductive-lubricant, wherein a second conductive-lubricant layer of the second conductive-lubricant-metal structure is plasma doped by growing the second conductive-lubricant layer on the second metal layer of the second conductive-lubricant-metal structure and immersing the second conductive-lubricant-metal structure in ions from plasma, wherein the plasma comprises ammonia (NH3);
applying compression and heat to the lamination stack to form a Printed Circuit Board (PCB);
and
removing at least a portion of the second conductive-lubricant-metal structure from the PCB.

5 more elements