Machining station and method for machining workpieces

A machining station for machining platelike workpieces (1) by means of at least one tool (10, 13, 14), in particular a drilling station for machining at least one circuit board, with

• a measuring device (16) comprising an optical system for acquiring data relating to a position of bores, in particular reference bores and/or through bores, in the workpiece (1),
• a drill (10, 13, 14) for generating bores, in particular through bores (2) and/or deep bores, in the workpiece (1), wherein the drill (10, 13, 14) has a device for detecting selected inner layers as a reference, wherein the device is configured to perform detection of the inner layers by the drill while generating through bores, and
• a data processor (17) connected to the measuring device (16) and configured to process data of the measuring device (16) and/or to control the drill (10, 13, 14),
• wherein the data processor (17) is configured to perform a set up adjustment between a desired drilling position and a desired bore depth and an actual position and actual depth as determined by the measuring device (16) for a bore present in the workpiece (1), and is configured to adapt the drilling position and bore depth, in particular the bore coordinates in all three spatial directions, by means of the drill (10, 13, 14), wherein the data processor (17) is configured to perform the set up for adapting the bore depth based on the measurement data from detecting selected inner layers, wherein the measuring device (16) is configured to perform a measuring of the bores after copper-plating a circuit board (1), and wherein the data processor (17) is configured to perform the set up to adapt the bore position based on the measurement data from measuring the bores (2) after copper plating the circuit board (1).