Electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorMasato Nomiya
Life of this patent
Estimating the term…
Abstract
An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.
Claims20
An electronic component comprising:
- a substrate including a first major surface, a second major surface, and a side surface;
- and
- a plurality of side wires on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate;
- wherein
- at least one portion of each of the plurality of side wires is indirectly provided on the side surface of the substrate;
- the electronic component further comprises an electrically insulating layer interposed between the side surface of the substrate and the at least one portion of each of the plurality of side wires;
- and
- each of the plurality of side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.
Dependencies are inferred from the claim text.