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US 11,963,301 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeong Ho Choi, Tae Seok Kim
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes: an insulating layer; a first circuit layer disposed on one surface of the insulating layer, and including a first circuit pattern and a first connection pad; and a surface treatment layer disposed on one surface of the first connection pad. The other surface of the first connection pad is covered by the insulating layer, and at least a portion of a side surface of the first connection pad is spaced apart from the insulating layer.
Claims20
A printed circuit board comprising:
- an insulating layer;
- a first circuit layer disposed on one surface of the insulating layer, and including a first circuit pattern and a first connection pad;
- and
- a surface treatment layer disposed on one surface of the first connection pad,
- wherein the other surface of the first connection pad is covered by the insulating layer, and at least a portion of a side surface of the first connection pad is spaced apart from the insulating layer,
- wherein a width of an exposed portion of the first connection pad is substantially the same as a width of portions of the first connection pad covered by the insulating layer, and
- wherein a roughness of an upper surface of the surface treatment layer is greater than a roughness of a side surface of the surface treatment layer.
4 more elements
A printed circuit board comprising:
- an insulating layer having first and second regions;
- a connection pad of which at least a portion is embedded in one surface of the insulating layer in the first region, wherein a width of an exposed portion of the connection pad is substantially the same as a width of portions of the connection pad covered by the insulating layer;
- a circuit pattern embedded in the one surface of the insulating layer in the second region;
- and
- a surface treatment layer disposed on one surface of the connection pad,
- wherein the insulating layer has a larger thickness in the second region than in the first region, and
- wherein a roughness of an upper surface of the surface treatment layer is greater than a roughness of a side surface of the surface treatment layer.
4 more elements
Dependencies are inferred from the claim text.