Cavity printed circuit board for three-dimensional IC package
AssigneeGoogle Inc.
InventorsYuan Jen Chang, Ronald Trinidad
Life of this patent
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Abstract
A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.
Claims12
A three-dimensional integrated circuit (IC) packaging structure, comprising:
- a first cavity printed circuit board (PCB) having a first cavity defined on a first surface of the first cavity PCB;
- and
- a second cavity PCB having a second cavity defined on a second surface of the second cavity PCB, wherein the first cavity PCB is disposed on the second cavity PCB having the first cavity aligned with the second cavity such that a third cavity is defined between the first and the second cavity PCBs.
Dependencies are inferred from the claim text.