Headset including in-ear microphone
AssigneeSamsung Electronics Co., Ltd.
InventorsHaekeu Park, Kyeongcheol Yoon, Hyeonyeong Jeong, Sunghoon Cho, Seonmi Kim, Jeock Lee, Seyoun Kwon
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AssigneeSamsung Electronics Co., Ltd.
InventorsHaekeu Park, Kyeongcheol Yoon, Hyeonyeong Jeong, Sunghoon Cho, Seonmi Kim, Jeock Lee, Seyoun Kwon
Estimating the term…
A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface and the second surface, a speaker seating portion formed by recessing by a specific depth from a first portion of the first surface toward the second surface, a space formed between the speaker seating portion and the second surface, a speaker hole penetrated from the speaker seating portion to the space, a microphone hole penetrated from a second portion of the first surface to the space, an acoustic hole formed by penetrating the second surface from the space, a speaker seated in the speaker seating portion, a first printed circuit board disposed on the second portion and having a via hole connected with the microphone hole, a second printed circuit board electrically connected with the first printed circuit board and a connection unit of the speaker, and a microphone mounted at a position aligned with the via hole on the first printed circuit board. Various other embodiments identified in this document are also possible.
A headset comprising an in-ear microphone, comprising:
A headset comprising an in-ear microphone, comprising:
Dependencies are inferred from the claim text.