Electronic device including sound component assembly
AssigneeSamsung Electronics Co., Ltd.
InventorsHyungwoo Lee, Jongchun Wee, Byounguk Yoon
Life of this patent
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Abstract
A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.
Claims20
An electronic device, comprising:
- a housing comprising a sound hole that is connected to a sound passage within the housing;
- a printed circuit board (PCB) in the housing;
- a sound module on the PCB in the housing, and adjacent to the sound hole, the sound module comprising a speaker or a receiver that is configured to emit or receive a sound through the sound passage connected to the sound hole;
- and
- a sound component assembly positioned between the sound hole and the sound module, and surrounding at least a portion of the sound passage,
- wherein the sound component assembly comprises:
- a sealing portion that surrounds the sound passage and that comprises an internal cavity therein that communicates with the sound passage, the sound passage sealed by the sealing portion by a first side of the sealing portion contacting at least a portion of the PCB;
- a mesh portion that traverses the sound passage and contacts a second side of the sealing portion, opposite to the first side of the sealing portion, and the mesh portion is configured to block foreign material from passing therethrough;
- and
- a cover portion that faces the PCB and covers a portion of the sealing portion or a portion of the mesh portion.
A sound component assembly for an electronic device, the sound component assembly comprising:
- a sealing portion contacting at least a portion of a printed circuit board (PCB) having a sound module mounted thereon;
- and
- a cover portion that faces the PCB and covers the sealing portion,
- wherein the sealing portion comprises a first material, the cover portion comprises a second material, and the second material has a greater hardness than the first material, and
- wherein the sealing portion further comprises:
- a protruding area contacting the PCB and protruding in a first direction toward the sound module;
- and a base area on a side of the protruding area towards a second direction that is opposite to the first direction.
Dependencies are inferred from the claim text.