Semiconductor light emitting device and external resonance type laser device
AssigneePanasonic Holdings Corporation
InventorsHiroyuki Hagino, Shinichiro Nozaki
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Abstract
A semiconductor light emitting device includes: a semiconductor light emitting element including a substrate and a plurality of light emitters arranged along an upper surface of the substrate; a first base disposed below a lower surface of the substrate; and a first bonding layer which bonds the semiconductor light emitting element to the first base. In the semiconductor light emitting device, a thermal conductivity of the substrate is higher than a thermal conductivity of the first bonding layer, and a thickness of the first bonding layer is less on one end side than on an other end side in an arrangement direction in which the plurality of light emitters are arranged.
Claims6
A semiconductor light emitting device, comprising:
- a semiconductor light emitting element including a substrate and a plurality of light emitters arranged along an upper surface of the substrate;
- a first base disposed below a lower surface of the substrate;
- and
- a first bonding layer which bonds the semiconductor light emitting element to the first base,
- wherein a thermal conductivity of the substrate is higher than a thermal conductivity of the first bonding layer,
- a thickness of the first bonding layer is less on one end side than on an other end side in an arrangement direction in which the plurality of light emitters are arranged,
- a thickness of the substrate is greater on the one end side than on the other end side in the arrangement direction, and
- the upper surface of the substrate is substantially parallel to a bonding surface of the first base bonded with the first bonding layer in the arrangement direction.
A semiconductor light emitting device, comprising:
- a semiconductor light emitting element including a substrate and a plurality of light emitters arranged along an upper surface of the substrate;
- a first base disposed below a lower surface of the substrate;
- and
- a first bonding layer which bonds the semiconductor light emitting element to the first base,
- wherein a thermal conductivity of the first base is higher than a thermal conductivity of the first bonding layer,
- a thickness of the first bonding layer is less on one end side than on an other end side in an arrangement direction in which the plurality of light emitters are arranged,
- a thickness of the substrate is greater on the one end side than on the other end side in the arrangement direction, and
- the upper surface of the substrate is substantially parallel to a bonding surface of the first base bonded with the first bonding layer in the arrangement direction.
Dependencies are inferred from the claim text.