Electronic device including grip sensing pad
AssigneeSamsung Electronics Co., Ltd.
InventorsSeokwoo Lee, Yeonghun Gu, Youngho Park, Jiwoo Lee, Kio Jung, Ko Choi, Woojin Choi
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AssigneeSamsung Electronics Co., Ltd.
InventorsSeokwoo Lee, Yeonghun Gu, Youngho Park, Jiwoo Lee, Kio Jung, Ko Choi, Woojin Choi
Estimating the term…
An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.
An electronic device, comprising:
Dependencies are inferred from the claim text.