Film and preparation process
AssigneeShenzhen Yuanzi Technology Co., Ltd.
InventorDing Wei
Life of this patent
Estimating the term…
Abstract
A film and a manufacturing process thereof, including a base layer, where each of front and back sides of the base layer is provided with a bonding layer, a functional layer, and a protective layer in sequence; the functional layer is composed of a first composite copper layer and/or a second composite copper layer; the first composite copper layer is formed by repeating copper coating on a surface of the bonding layer 2 to 500 times; and the second composite copper layer is formed by repeating copper coating on a surface of the bonding layer 2 to 500 times. The film has low cost, simple process, and prominent appearance performance, and the present disclosure belongs to the technical field of energy storage unit materials.
Claims25
A film, comprising a base layer, wherein each of front and back sides of the base layer is provided with a bonding layer, a functional layer, and a protective layer in sequence;
- the functional layer comprises a first composite copper layer and a second composite copper layer;
- the first composite copper layer is formed by repeating copper coating by a physical vapor deposition (PVD) process on a surface of the bonding layer 1 to 500 times;
- and
- the second composite copper layer is formed by repeating copper coating by an electroplating process on a surface of the first composite copper layer 1 to 500 times, and wherein
- the surface of the functional layer has no pinholes or wrinkles.
A manufacturing process of a film, comprising the following steps:
- step 1. forming a bonding layer on a base layer;
- step 2. forming a functional layer at an outer side of the bonding layer, wherein the functional layer is composed of a first composite copper layer and a second composite copper layer;
- the first composite copper layer is formed by repeating copper coating by a physical vapor deposition (PVD) process on the bonding layer 1 to 500 times;
- and the second composite copper layer is formed by repeating copper coating by an electroplating process on the first composite copper layer 1 to 500 times;
- and
- step 3. forming a metallic material protective layer or a non-metallic material protective layer at an outer side of the functional layer.
Dependencies are inferred from the claim text.