Integrated circuit package with magnet having a channel
AssigneeAllegro MicroSystems, LLC
InventorsRavi Vig, William P. Taylor, Paul A. David, P. Karl Scheller, Andreas P. Friedrich
Life of this patent
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Abstract
An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
Claims16
An integrated circuit package comprising:
- a lead frame having a first surface and a second opposing surface;
- a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame;
- a magnet attached to the second surface of the lead frame and having a non-contiguous central region and at least one channel extending laterally from the central region;
- and
- an overmold material forming an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
A method of fabricating an integrated circuit package comprising:
- forming a lead frame having a first surface and a second opposing surface;
- forming circuitry in a first surface of a semiconductor die;
- attaching a second surface of the semiconductor die to the first surface of the lead frame;
- forming a magnet with a channel;
- attaching the magnet to the second surface of the lead frame to form a subassembly, wherein the magnet comprises a non-contiguous central region and at least one channel extending laterally from the central region;
- and
- applying an overmold material to the subassembly to enclose the semiconductor die and a portion of the lead frame.
Dependencies are inferred from the claim text.