Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure

A semiconductor package structure, comprising:

• a carrier having a first face and a second face opposite to the first face, the first face being configured to connect the carrier with an external circuit structure;
• a first electronic component adjacent to the first face of the carrier;
• a second electronic component adjacent to the second face of the carrier;
• a first opening in the carrier, connecting the first face and the second face;
• a first bonding wire passing through the first opening and having a first end bonded to the first electronic component and a second end bonded to the second electronic component;
• and
• a second bonding wire passing through the first opening and having a first end bonded to the first electronic component and a second end bonded to the carrier.

A method of manufacturing a semiconductor package structure, comprising:

• providing a carrier having a first face and a second face opposite to the first face, the carrier defining a first opening connecting the first face and the second face of the carrier;
• forming an electrical extension structure at the first face of the carrier;
• attaching a first electronic component adjacent to the first face of the carrier;
• encapsulating the first electronic component and the electrical extension structure by a molding operation;
• attaching a second electronic component adjacent to the second face of the carrier;
• and
• forming a first bonding wire having a first end bonded to the first electronic component and a second end bonded to the second electronic component, wherein the first bonding wire passes through the first opening of the carrier.