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US 11,961,830 B2Granted
Module
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihito Otsubo, Motohiko Kusunoki, Takanori Uejima
Life of this patent
Estimating the term…
Abstract
A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.
Claims13
A module comprising:
- a board having a first surface;
- a first component and a second component mounted on the first surface;
- a wire disposed to extend across the first component and having one end and the other end;
- a sealing resin sealing the first component and the second component;
- and
- a shield film provided to cover the sealing resin, wherein
- the one end is connected to the second component at an upper surface of the second component,
- the one end is connected so as to form a first angle with respect to the upper surface of the second component, and the other end is connected to an upper surface of another component so as to form a second angle greater than the first angle,
- the wire is grounded, and
- wherein a height of the upper surface of the second component is lower than a height of an upper surface of the first component.
7 more elements
A module comprising:
- a board having a first surface;
- a first component and a second component mounted on the first surface;
- a wire disposed to extend across the first component and having one end and the other end;
- a sealing resin sealing the first component and the second component;
- and
- a shield film provided to cover the sealing resin, wherein
- the one end is connected to the second component at an upper surface of the second component,
- the one end is connected so as to form a first angle with respect to the upper surface of the second component, and the other end is connected to the first surface so as to form a second angle greater than the first angle,
- the wire is grounded,
- a matching circuit is mounted on the first surface in addition to the first component, and
- the wire is disposed to extend collectively across the first component and the matching circuit.
8 more elements
Dependencies are inferred from the claim text.