Back to results
US 11,961,825 B2Granted
Microelectronic device assemblies and packages including multiple device stacks and related methods
AssigneeMicron Technology, Inc.
InventorsAparna U. Limaye, Dong Soon Lim, Randon K. Richards, Owen R. Fay
Life of this patent
Estimating the term…
Abstract
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.
Claims20
A microelectronic device assembly, comprising:
- a substrate;
- two or more stacks of multiple levels of microelectronic devices, the microelectronic devices of different stacks of a same level operably coupled to conductive traces carried by a common dielectric film to via locations outside a footprint of at least one of the two or more stacks and to other conductive traces carried by the common dielectric film extending laterally between at least some of the microelectronic devices of the two or more stacks of multiple levels of microelectronic devices;
- and
- conductive vias extending through the common dielectric film at the via locations to exposed conductor of the substrate and in contact with at least some of the conductive traces or the other conductive traces.
1 more element
A method comprising:
- providing a reconstructed wafer or panel comprising semiconductor dice in mutually spaced relationship and having a polymer film over active surfaces of the semiconductor dice;
- exposing bond pads on the active surfaces through the polymer film;
- forming conductive traces from the exposed bond pads over the polymer film to via locations beyond one or more lateral peripheries of the semiconductor dice and between the semiconductor dice;
- singulating groups of two or more semiconductor dice through the polymer film and stacking the singulated groups of two or more semiconductor dice;
- forming via holes through the polymer film on stacks of the singulated groups at the via locations;
- and
- filling the via holes with conductive material.
4 more elements
Dependencies are inferred from the claim text.