Semiconductor package including stacked chip structure

A semiconductor package comprising:

• a package substrate including an upper surface with a bonding pad;
• a first lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the first lower semiconductor chip includes a connect edge region including a connection pad and an open edge region including a dam structure;
• a bonding wire having a first height above the upper surface of the first lower semiconductor chip and connecting the bonding pad and the connection pad;
• an upper semiconductor chip disposed on the upper surface of the first lower semiconductor chip using an inter-chip bonding layer;
• and
• a molding portion on the package substrate and substantially surrounding the first lower semiconductor chip and the upper semiconductor chip,
• wherein the dam structure includes dummy bumps disposed in the open edge region, and dummy wires extending between adjacent ones of the dummy bumps and having a second height above the upper surface of the first lower semiconductor chip.

A semiconductor package comprising:

• a package substrate including an upper surface including bonding pads;
• a lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the lower semiconductor chip includes a connect edge region including connection pads and an open edge region including a dam structure;
• a spacer chip disposed on the upper surface of the package substrate;
• an upper semiconductor chip disposed on the upper surface of the lower semiconductor chip and an upper surface of the spacer chip;
• an inter-chip bonding layer between the upper semiconductor chip and the lower semiconductor chip and the spacer chip;
• bonding wires respectively connecting the bonding pads and the connection pads;
• and
• a molding portion on the package substrate and substantially surrounding the lower semiconductor chip, the spacer chip and the upper semiconductor chip,
• wherein the dam structure includes at least two dummy bumps and at least one dummy wire connecting the at least two dummy bumps.