Forming and/or configuring stacked dies
AssigneeXilinx, Inc.
InventorsPraful Jain, Martin Voogel, Brian Gaide
Life of this patent
Estimating the term…
Abstract
Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.
Claims7
A method of implementing a multi-chip device, the method comprising:
- determining whether segments of interchangeable dies in a die stack are functional, N number of the interchangeable dies being in the die stack, segments that align in the interchangeable dies forming respective slivers;
- and
- configuring the interchangeable dies into M number of logical dies when each sliver includes at least the M number of segments that are functional, the M number being less than the N number, wherein configuring the interchangeable dies into the M number of the logical dies further includes activating segments of each sliver that includes more than the M number of segments that are functional based on a projected temperature of the die stack, a projected static power of the die stack, a projected performance of the die stack, or a combination thereof.
Dependencies are inferred from the claim text.