Semiconductor device assemblies including multiple stacks of different semiconductor dies
AssigneeMicron Technology, Inc.
InventorBlaine J. Thurgood
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Abstract
A semiconductor device assembly is provided. The assembly comprises a package substrate, a first stack of semiconductor dies having a first set of planform dimensions disposed over a first location on the substrate, a second stack of semiconductor dies having a second set of planform dimensions different from the first set disposed over a second location on the substrate, and an encapsulant at least partially encapsulating the substrate, the first stack and the second stack. The first stack of semiconductor dies has a first planform area, the second stack of semiconductor dies has a second planform area, and a sum of the first and second planform areas can be at least 50%, 67%, 75% or even more of an area of the package substrate.
Claims20
A semiconductor device assembly, comprising:
- a package substrate having an upper surface with an upper surface area;
- a first shingled stack including a plurality of first semiconductor dies, each first semiconductor die of the plurality having a first length and a first width, the first shingled stack overlying a first area of the package substrate;
- a second shingled stack including a plurality of second semiconductor dies, each second semiconductor die of the plurality having a second length and a second width, the second shingled stack overlying a second area of the package substrate different from the first area;
- and
- an encapsulant at least partially encapsulating the package substrate, the first shingled stack and the second shingled stack,
- wherein the first length is different than the second length and the second width.
A method of making a memory device, comprising:
- providing a package substrate having an upper surface with an upper surface area;
- stacking a plurality of first semiconductor dies in a first shingled stack, each first semiconductor die of the plurality having a first length and a first width, the first shingled stack overlying a first area of the package substrate;
- stacking a plurality of second semiconductor dies in a second shingled stack, each second semiconductor die of the plurality having a second length and a second width, the second shingled stack overlying a second area of the package substrate different from the first area;
- and
- providing an encapsulant to at least partially encapsulate the package substrate, the first shingled stack and the second shingled stack,
- wherein the first length is different than the second length and the second width.
Dependencies are inferred from the claim text.