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US 11,961,818 B2Granted
Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems
AssigneeMicron Technology, Inc.
InventorsAndrew M. Bayless, Brandon P. Wirz
Life of this patent
Estimating the term…
Abstract
This patent application relates to methods and apparatus for temperature modification within a stack of microelectronic devices for mutual collective bonding of the microelectronic devices, and to related substrates and assemblies.
Claims19
A substrate, comprising:
- mutually laterally spaced locations, each respective location including an array of terminal pads on a substrate surface for connection to conductive elements of a stack of microelectronic devices to be placed on the respective location;
- and
- one or more heat transfer structures on the substrate surface at least proximate each respective location and electrically isolated from the array of terminal pads thereof, the one or more heat transfer structures configured to completely vertically underlie a lowermost microelectronic device of the stack of microelectronic devices, and wherein at least one of the one or more heat transfer structures extends into a street area of the substrate adjacent the respective location.
A microelectronic device assembly, comprising:
- a stack of microelectronic devices over a substrate segment extending laterally beyond sides of the stack of microelectronic devices;
- one or more metal heat transfer structures on a surface of the substrate segment and at least adjacent to one or more sides of the stack of microelectronic devices,
- the one or more metal heat transfer structures electrically isolated from circuits of the microelectronic devices of the stack and of the substrate segment,
- an uppermost surface of the one or more metal heat transfer structures positioned vertically below a lowermost surface of a lowermost one of the microelectronic devices of the stack, and wherein at least one of the one or more heat transfer structures extends into a street area of the substrate segment adjacent a respective location;
- a dielectric encapsulant material at least extending over sides of the stack of microelectronic devices and contacting the surface of the substrate segment;
- and
- conductive elements vertically between the surface of the substrate segment and the lowermost surface of the lowermost one of the microelectronic devices of the stack.
4 more elements
An electronic system, comprising:
- one or more input devices;
- one or more output devices;
- at least one microprocessor device;
- and
- at least one memory device;
- wherein at least one of the at least one microprocessor device and the at least one memory device, or a physical combination thereof, comprises:
- a stack of microelectronic devices;
- a substrate segment underlying the stack of microelectronic devices;
- and
- one or more metal heat transfer structures on a surface of the substrate segment facing the stack of microelectronic devices and electrically isolated from circuitry of the stack of microelectronic devices and of the substrate segment, the one or more heat transfer structures completely vertically underlying a lowermost microelectronic device of the stack of microelectronic devices, and wherein at least one of the one or more heat transfer structures extends into a street area of the substrate segment adjacent a respective location.
7 more elements
Dependencies are inferred from the claim text.