Antenna apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Wei Kuo, Wen-Shiang Liao
Life of this patent
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Abstract
A package structure includes a first die, a second die over and electrically connected to the first die, an insulating material around the second die, a first antenna extending through the insulating material and electrically connected to the second die, the first antenna being adjacent to a first sidewall of the second die, wherein the first antenna includes a first conductive plate extending through the insulating material, and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is between the plurality of first conductive pillars and the first sidewall of the second die.
Claims20
A package structure comprising:
- a first die;
- a second die over and electrically connected to the first die;
- an insulating material around the second die;
- a first antenna extending through the insulating material and electrically connected to the second die, the first antenna being adjacent to a first sidewall of the second die, wherein the first antenna comprises:
- a first conductive plate extending through the insulating material;
- and
- a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is between the plurality of first conductive pillars and the first sidewall of the second die, wherein the plurality of first conductive pillars are electrically grounded, and wherein the first conductive plate and the plurality of first conductive pillars overlap the first die.
A package comprising:
- a first package structure over and electrically connected to a first redistribution structure, wherein the first package structure comprises:
- a first die over and electrically connected to a second die;
- an insulating material encapsulating the first die;
- a first antenna comprising a first portion extending through the insulating material to a feed line between the first die and the second die, the first portion of the first antenna being in physical contact with the feed line;
- and
- a third die over and electrically connected to the first redistribution structure;
- and
- a first encapsulant surrounding the first package structure and the third die.
A package structure comprising:
- a bottom die;
- a first die and a second die over and electrically connected to the bottom die;
- an insulating material around each of the first die and the second die;
- a first antenna extending through the insulating material and electrically connected to the first die, the first antenna being adjacent to a first sidewall of the first die;
- and
- a second antenna extending through the insulating material and electrically connected to the second die, the second antenna being adjacent to a first sidewall of the second die, wherein a second sidewall of the first die and a second sidewall of the second die are adjacent to each other, and no antenna is disposed between the second sidewall of the first die and the second sidewall of the second die.
Dependencies are inferred from the claim text.