Electronic package structure with reinforcement element
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
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Abstract
At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.
Claims8
An electronic package structure, comprising:
- an electronic structure;
- a wiring structure disposed over the electronic structure;
- a bonding element connecting the wiring structure and the electronic structure;
- and
- a reinforcement element attached to the wiring structure;
- wherein an elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element,
- wherein the bonding element and the reinforcement layer are disposed adjacent to two opposite sides of the wiring structure, respectively, and
- wherein a hardness of the reinforcement element is greater than a hardness of the wiring structure.
An electronic package structure, comprising:
- an electronic structure;
- a wiring structure disposed over the electronic structure;
- a bonding element connecting the wiring structure and the electronic structure;
- and
- a reinforcement element attached to the wiring structure;
- wherein an elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element, and
- wherein a coefficient of thermal conductivity of the reinforcement element is greater than a coefficient of thermal conductivity of the wiring structure.
An electronic package structure, comprising:
- an electronic structure;
- a wiring structure disposed over the electronic structure;
- a bonding element connecting the wiring structure and the electronic structure;
- and
- a reinforcement element attached to the wiring structure;
- wherein an elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element,
- wherein the bonding element and the reinforcement layer are disposed adjacent to two opposite sides of the wiring structure, respectively, and
- wherein a coefficient of thermal expansion (CTE) of the reinforcement element is less than a CTE of the wiring structure.
Dependencies are inferred from the claim text.