Semiconductor package

A semiconductor package comprising:

• a support part;
• a first semiconductor chip and a second semiconductor chip provided on the support part and each including a plurality of signal pads;
• a plurality of electrode pads provided to be spaced apart from the support part outside the support part;
• a wire including a first wire connecting one of the signal pads of the first semiconductor chip and one of the signal pads of the second semiconductor chip, a second wire connecting another signal pad of the first semiconductor chip and one of the electrode pads, and a third wire connecting another signal pad of the second semiconductor chip and another electrode pad;
• a buffer layer provided on the first semiconductor chip;
• an adhesive layer provided on the buffer layer;
• a pressure-reducing layer provided on the adhesive layer;
• and
• a mold layer provided on the pressure-reducing layer.

A battery management system comprising a semiconductor package, wherein the semiconductor package includes:

• a support part;
• a first semiconductor chip and a second semiconductor chip provided on the support part and each including a plurality of signal pads;
• a plurality of electrode pads provided to be spaced apart from the support part outside the support part;
• a wire including a first wire connecting one of the signal pads of the first semiconductor chip and one of the signal pads of the second semiconductor chip, a second wire connecting another signal pad of the first semiconductor chip and one of the electrode pads, and a third wire connecting another signal pad of the second semiconductor chip and another electrode pad;
• a buffer layer provided on the first semiconductor chip;
• an adhesive layer provided on the buffer layer;
• a pressure-reducing layer provided on the adhesive layer;
• and
• a mold layer provided on the pressure-reducing layer,
• wherein the second semiconductor chip is provided with a voltage sensing unit, and the first semiconductor chip is provided with a microcontroller that receives a sensing voltage from the voltage sensing unit and converts the sensing voltage into voltage information data that is digital data to transmit the voltage information data to a master controller.