Via for semiconductor device connection and methods of forming the same

A semiconductor device comprising:

• a first metal pad and a second metal pad on a first substrate;
• a conductive connector on and electrically coupled to the first metal pad;
• a component device comprising a bottom terminal on and electrically coupled to the conductive connector, wherein the component device comprises a top terminal opposite the bottom terminal;
• a gap fill material on the first substrate and surrounding the component device;
• a conductive via extending through the gap fill material, wherein the conductive via is on and electrically coupled to the second metal pad;
• and
• a redistribution line extending through the gap fill material, wherein the redistribution line physically contacts a top surface and a side surface of the top terminal, and wherein the redistribution line electrically couples the top terminal to the conductive via.

A semiconductor device comprising:

• a first substrate comprising a first terminal and a second terminal;
• a first component device comprising a second substrate and a third terminal on the second substrate, wherein the third terminal is bonded to the first terminal;
• a gap fill material on the first substrate and surrounding the first component device;
• a conductive via extending from a top surface of the gap fill material to the second terminal;
• and
• a conductive line extending along a top surface of the first component device and a top surface of the conductive via, wherein the conductive line electrically couples the first component device to the second terminal through the conductive via.