Back to results
US 11,961,799 B2Granted
Semiconductor substrate structure and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen Hung Huang
Life of this patent
Estimating the term…
Abstract
A semiconductor substrate structure and a method of manufacturing a semiconductor substrate structure are provided. The semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.
Claims18
A semiconductor substrate structure, comprising:
- a substrate defining a cavity;
- an electronic device disposed in the cavity;
- a filling material disposed on a first region of an upper surface of the electronic device;
- a dielectric layer disposed over the electronic device and comprising an extending portion extending into the filling material;
- and
- a first via in the dielectric layer, wherein the first via is horizontally overlapping and spaced apart from the filling material.
3 more elements
A semiconductor substrate structure, comprising:
- a substrate defining a cavity;
- an electronic device disposed in the cavity and spaced apart from the substrate by a gap;
- a filling material disposed in the gap and covering a first region of an upper surface of the electronic device;
- a first conductive pad disposed over the upper surface of the electronic device and spaced apart from the filling material;
- and
- a second conductive pad disposed over the upper surface of the electronic device and between the first conductive pad and the filling material, wherein a space between the first conductive pad and the second conductive pad is exposed by the filling material.
3 more elements
A semiconductor substrate structure, comprising:
- a substrate defining a cavity;
- an electronic device disposed in the cavity and spaced apart from the substrate by a gap;
- a filling material disposed in the gap and covering a first region of an upper surface of the electronic device;
- a first conductive pad disposed over the upper surface of the electronic device and spaced apart from the filling material;
- and
- a via in the substrate, wherein the via horizontally overlaps the filling material,
- wherein the filling material comprises a lower portion under a lower surface of the electronic device, and the via is free from horizontally overlapping the lower portion.
4 more elements
Dependencies are inferred from the claim text.